High-performance thermal paste designed for demanding cooling applications, overclocking systems, processors, graphics cards, laptops, and gaming consoles.

Excellent thermal conductivity of 12.5 W/mK helps improve heat transfer between the chip and cooler.

Reliable long-lasting formula resists drying out and delivers stable performance without curing.

Non-electrically conductive compound helps provide safer installation on sensitive components.

Wide compatibility with air coolers, water cooling solutions, and extreme cooling environments.

5.55g capacity makes it suitable for multiple applications and repeated maintenance.

Included accessories such as a spatula help ensure smooth and even application.