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Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm

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Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 1
Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 2
Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 3
Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 4
Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 5
Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 6
Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 7
Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 8
Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 9
Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 10
Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 11
Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 12
Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 13
Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 14
Cooler Master TPX-NOPP-9020-R1 Thermal Pad 2.0 mm - Image 15
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Description

  • Device and component cooling: The Cooler Master TPX-NOPP-9020-R1 thermal pad provides a versatile heat-transfer solution for electronic devices and components.
  • Dimensions: 95 × 45 mm with a 2.0 mm thickness, easily cut to fit your application.
  • Nano-particle formulation: Thermal conductivity of 13.3 W/m·K supports rapid heat transfer.
  • Double-sided adhesive: Helps maintain secure contact between surfaces.
  • Protective properties: Non-toxic, non-corrosive and electrically insulating, with a heat-resistant formula designed to resist hardening.
  • Versatile applications: Suitable for cooling applications involving motherboards, CPUs, GPUs, hard drives, disk drives, IGBT modules, laptops and other electronic devices.
  • Operating temperature: -40 to 200°C.
  • Material specifications: Density of 3.4 ± 0.2 g/cc, hardness of 30–60 Sc and breakdown voltage of 6 kV at 1 mm.
  • Color: Purple.

Specifications

ColorPurple
Length95 cm
Width45 cm
Height2 cm

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